來源：微彈簧圈MCS 發布時間：2017.05.02
新產品簡介-微彈簧圈MCS
背 景 Background
微螺旋彈簧（Micro-coil Spring，MCS）封裝技術因應復雜、惡劣使用環境運而生。彈簧結構不僅繼承了CCGA的優異表現，更能夠承受更大的應力，以確保連接機構的穩定性，從而獲得更長的使用壽命，未來將在航天航空、軍事上發揮重要的作用。
Micro-coil Spring (MCS) package emerges at the right moment for temperature extremes, thermal cycling and vibration. Helical spring structure not only inherit the performance advantages of other CCGA, but also bear great stress so as to ensure the integrity of the solder connection and function, and greatly extend the service life of components. Micro-coil Spring will play an impaortant rule in aerospace and military filed.
構 造 圖 Structure
微彈簧圈由本體螺旋彈簧和釬料鍍層組成，其兩端分別存在一個相鄰的閉合線圈。它的本體螺旋彈簧部分是由鈹銅合金制成。
Micro-coil spring is consist of helical spring and solder coating.Ontology helical spring is made of beryllium copper alloy.
有限元模擬 Finite Element Simulation
MCS出現失效的部分在螺旋彈簧線圈上。
Failure is likely to occur in the coil windings rather than at the solder fillet.
失效模式 Failure Modes
MCS封裝的失效形式主要有兩種，如圖所示。
MCS package has two main failure modes, as are shown.
規格與型號 Specifications
